Zhiwei Cai has served as Executive Vice President, Engineering Adhesives, since 2019. He has led our Engineering Adhesives business since its inception in 2016. Previously, he served as Vice President, TONSAN and Electronics, from 2014-2016, and Director, Electronics Materials, from 2012-2014. Prior to joining H.B. Fuller, Mr. Cai held various leadership roles in electronics at Henkel Corporation from 2004-2010, served as Vice President, International Business Development at Engent. Inc., from 2003-2004, held several management roles at Siemens from 1993-2003, and held positions in engineering management at China Aviation Technology from 1987-1993. He earned his bachelor’s degree in automation, electricity, and computer theory and his master’s degree in mechanical engineering from Beijing University of Aeronautics and Astronautics.